If you want to get a peek inside the Sony Xperia XZ, then you should check out the teardown pictures below. It shows Sony’s latest greatest picked apart piece-by-piece and makes you appreciate the efforts of the company’s engineers. It’s interesting to note that we couldn’t see any sign of dual heat pipes, which Sony has used on the Xperia Z5 and X series to control thermal performance. Maybe, we missed something, or Sony could be using a new way to dissipate heat in the Xperia XZ. You can check out the full disassembly guide below.
Sony Xperia XZ teardown pics
First of all you will need to remove the SIM card slot. Then, use a hair dryer or something equivalent along the edges of the display and use a guitar pick to carefully pry the display away from the chassis.
The Xperia XZ uses a Synaptics S3330 touch controller.
You will find black waterproof sealing foam around the edges of the display.
The SIM card slot also includes a rubber seal, as seen in previous water resistant Xperia models.
You will now need to remove the SIM card information sticker as well as the stainless steel plate which houses the battery.
The battery is confirmed to have a 2900mAh capacity and has part number LIS1632ERPC. The battery is fixed in place using glue, which shouldn’t be too difficult to remove, if you need to replace the battery.
Here you can see the NFC coil found on the metal plate.
The sub-board for the USB Type-C and microphone then needs to be removed, along with the vibration motor flex board.
Here you can see the USB Type-C soft board and Microphone board.
The USB Type-C port has a red rubber seal to keep the internals water resistant.
The side key board includes the fingerprint power button sensor.
At the bottom, you will find the main antenna and coaxial cable module.
The speaker module can be found on the back of the main antenna frame.
Below you can see the front and rear camera modules removed, along with the motherboard.
A close up of the 23MP rear camera lens and 13MP front camera.
Here you can find some the triple image sensors including on-board laser focus, RGBC-IR and flash.
This is how the sensors line up on the rear.
A big departure from previous models is that the rear part of the chassis does not include any kind of heat pipe. The picture below shows the headphone module removed, along with the volume and camera buttons.
ALPS supplies the headphone module and is sealed to the phone frame using foam.
Here you can see the front of the motherboard, which includes the following chips:
– Qorba QM78064 High Frequency RF Fusion Module
– Skyworks Sky77660-11 power amplifier
– Qualcomm WTR3925 RF Transceiver
– Qualcomm WTR4905 RF Transceiver
– Bosch BMI160 gyroscope
– Qualcomm WCD9335 audio decoder chip
– SK hynix H26M78208CMR 32GB ROM
– Qualcomm WSA8810 loudspeaker amplifier
– Qualcomm PMI8996 power management chip
The back of the motherboard shows the following chips:
– Murata (package) Wi-Fi/BT/FM/GPS
– NXP PN547 NFC control chip
– Qualcomm PM8996 power management chip
– SK Hynix 3GB RAM + Qualcomm Snapdragon 820 chipset
All parts of the Xperia XZ laid out in one picture.