Sony announces Exmor RS: Stacked CMOS image sensor

by XB on 20th August 2012

in Featured Content, Imaging

Sony has lifted the lid on its new ‘Exmor RS’ camera sensor, which we saw trademarked recently. Shipments of the new CMOS image sensor will commence in October.  It uses the same stacked structure that we’ve heard of before, so it sounds as if ‘Exmor RS’ is the new marketing name for this CMOS chip.

The stacked structure of the Exmor RS sensor “layers the pixel section, containing formations of back-illuminated pixels over the chip affixed with mounted circuits for signal processing, in place of conventional supporting substrates used for back-illuminated CMOS image sensors.”

Sony plans on launching three models of the Exmor RS sensor for smartphones and tablets along with three corresponding auto-focus image modules that will have these sensors baked in. The two higher-end sensors will be released in 2013 and feature RGBW coding (captures clearer images in low light due to the inclusion of a white pixel in addition to the RGB matrix) and HDR video functionality. Another advantage of the chip is its compact size.

This news confirms our suspicions that the Sony Xperia GX and soon-to-be released Xperia T/TX with its 13MP camera sensor will not be using this new stacked structure. However, the release date of the new 13MP stacked sensor and imaging module for March 2013 puts it right on target for Sony Mobile’s 2013 flagship.

Three Exmor RS sensors/imaging modules to be released:

1) IMX135: Type 1/3.06 model with 13.13 effective megapixels.
Features: ‘RGBW coding’ function and ‘HDR (High Dynamic Range) movie’ function.
Release: January 2013
Cost: 1,500 JPY

Imaging module ‘IU135F3-Z’
Features: Bright, high-resolution F2.2 lens.
Release: March 2013
Cost: 8,000 JPY

2) IMX134: Type 1/4 model with 8.08 effective megapixels.
Features: ‘RGBW coding’ function and ‘HDR (High Dynamic Range) movie’ function.
Release: March 2013
Cost: 1,000 JPY

Imaging module ‘IU134F9-Z’
Features: Thin and compact lens (W:8.5 x D:8.5 x H:4.2mm)
Release: May 2013
Cost: 5,000 JPY 

3) ISX014: Type 1/4 model with 8.08 effective megapixels.
Features: Built-in camera signal processing function.
Release: October 2012
Cost: 1,200 JPY

Imaging module ‘IUS014F-Z’
Features: All-in-one imaging module that comprises an image sensor with built-in camera signal processing function and built-in auto-focus and picture adjustment function.
Release: November 2012
Cost: 6,000 JPY

Via Sony.

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