Xperia Z2 disassembly guide

The Sony Xperia Z2 will be in limited supply when it starts to launch across most European and Asian territories from April 2014. However, the handset is already out in Taiwan, so it’s great to see CNMO.com dismantle the handset in a comprehensive teardown.

Checking out each and every picture really makes you appreciate the engineering genius that has gone into making the Xperia Z2. See Sony’s latest flagship dismantled in all of its glory below.

Xperia Z2 disassembly guide

[Click to enlarge images]

CNMO were also the ones to dismantle the Xperia Z1, which we reported on back in September 2013. Obviously, apart from the 5.2-inch screen size of the Xperia Z2, the design remains largely the same as the Xperia Z1.

The Xperia Z2’s rear is also made of glass, much like the Xperia Z1. The process to remove the back shell remains the same.

To remove the back shell, you need to use a very thin metal bar, or something equivalent, to pry the bottom of the shell open. The rear shell is glued on, so you will need to gently poke the glue and then move across to pry the bottom open.

Do not rush the procedure, be very patient. This will take some time to do. Use your thin metal bar to pry open all sides to successfully remove the rear shell.

Once the rear cover is removed, you will notice the battery and the outside of the motherboard. The battery is packed in a yellow tape, whilst the motherboard is wrapped in a tightly shielded metal cover.

The rear glass panel of the Xperia Z2 is extremely thin, so please keep it in a safe place.

A first look at the motherboard, with a tight shielded metal cover.

Towards the bottom of the handset, you can see the battery, speaker and vibrator.

To get a proper look inside the phone, you will need to remove the screws holding the motherboard’s metal cover in place .

You will need to remove six cross-head screws altogether.

With the screws removed, you should take out the battery i.e. you are disconnecting the power supply. You can see from the picture that the Xperia Z2 has a 3200mAh capacity (3.8V; 12.2Wh).

Once the battery is removed, you will need to disconnect the remaining cables and parts. This is to ensure that you don’t damage the motherboard on removal.

This picture shows which parts need to be removed, including the Sony Xperia Z2 rear camera.

Here is a rear view of the motherboard, this is the side covered with the metal shield when the rear cover was first removed.

Here is the front view of the motherboard. It shows all of the interfaces including microSD memory card slot, micro SIM slot, micro USB interface as well as the front facing camera.

After removing the motherboard, you will notice the 3.5mm headphone jack towards the top right of the picture below.

Here you can see a close-up of the Xperia Z2’s speaker (left) and vibrator (right).

Another close-up of the speaker.

This is the signal like (RF antenna cable), used to enhance wireless signals.

The cables are neatly bonded together, making it easy to distinguish between cables when dismantling the handset.

Once the motherboard is removed, you can now look to take out the metal shield. A new design makes this an easy task.

Here you can see the back of the motherboard chip.

Here you can see the front of the motherboard chip. You will notice thermal paste covering some of the chips.

The Qualcomm PM8941 is a power management IC.

The Samsung 3GB RAM (K3QF7F70DM-QGCF) can be seen below, it has a speed of 930MHz.

The Xperia Z2 uses a NXP TFA9890 speaker driver. It can deliver 7.2 W peak output power into an 8 ? speaker at a supply voltage of 3.6 V. The internal boost converter raises the supply voltage to 9.5 V, providing ample headroom for major improvements in sound quality.

Here you can see the Samsung 16GB internal storage chip (340: KLMAG2GEAC-B001). This uses eMMC version 4.5 with the eMMC Pro Class2000.

The Xperia Z2 uses the Qualcomm WCD9320 audio decoder, which supports up to which support up to 24-bit/192kHz.

Here you can see the Skyworks SKY77619 multiband multimode power amplifier module for Quad-Band GSM / EDGE and Penta-Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE.

This is the Skyworks SKY77753 power amplifier module for Penta-Band FDD LTE / TD-SCDMA / TDD LTE – Bands 7, 34, 38, 39, 40, 41. It gives the handset 4G network support.

The Qualcomm RF Transceiver (WTR1625L) is the company’s smallest, most integrated RF transceiver supporting unparalleled connectivity worldwide. It is designed to accommodate all cellular modes and 2G, 3G and 4G/LTE frequency bands and band combinations that are either deployed or in commercial planning globally.

The Qualcomm PM8841 is a power management IC.

Here you can see the Qualcomm LTE chip (WTR2100).

The Qualcomm QFE1101 is a PA power management chip. This is an APT (Average Power Tracker) not ET (Envelope Tracker). It helps to reduce power consumption of mobile phone standby time on 4G networks.