There has been much chatter over the supposed heat issues that surround the Qualcomm Snapdragon 810 chipset. We have already talked about the throttling that takes place within the chipset, lowering the processor speeds to handle the heat dissipation. Qualcomm produced a v2.1 revision of the Snapdragon 810 chipset according to reports with improved thermal management and it looks like Sony is using this latest version in its Xperia Z3+ and Xperia Z4 Tablet.
The kernel source code for the latest software (version 28.0.A.4.8) for these devices was published by Sony. Within the code there are references to “msm8994-v2.1”, where MSM8994 is the model number for the Qualcomm Snapdragon 810. This appears within the source code for both the Xperia Z3+ and Xperia Z4 Tablet, suggesting Sony is using the revised 810 chipset for both devices.
To get an idea what Sony is facing in terms of heat issues, check out the video below from our friends at Btekt. The video demos some of the camera features from the Xperia Z3+ and frequently the phone produces warning messages that the camera may close due to high temperatures. The phone that Btekt is testing is a prototype running pre-release firmware, so fingers-crossed these issues won’t occur so frequently in the final retail release.